Hot spot in microelectronic structure

a) A hot spot in a microelectronic structure is generating unwanted heat. This heat could damage heat sensitive structures in the proximity. A usual strategy is to guide the heat with a heat conductive layer to a heat sink. Left: A conventional heat conductor is normally roughly isotropic. The lateral temperature gradient is small and sensitive structures have to be placed far away. Right: In the case of a quasi 1D heat conductor as is promoted here, heat is channelled away and sensitive structures can be placed much closer. b) Thermal image on the surface of the 1D heat conductor La5Ca9Cu24O41 (LCCO). Left: With the 1D structures perpendicular to the surface resulting in a very localized symmetric heating after a 40 ms heat pulse. Right: With the 1D structures parallel to the surface resulting in a highly asymmetric streaked heating pattern due to the large magnon heat conductivity in the (diagonal) direction.

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